System and method for implementing a single chip having a multiple sub-layer PHY

ABSTRACT

A system and method are disclosed for supporting 10 Gigabit digital serial communications. Many of the functional components and sublayers of a 10 Gigabit digital serial communications transceiver module are integrated into a single IC chip using the same CMOS technology throughout the single chip. The single chip includes a PMD transmit/receive CMOS sublayer, a PMD PCS CMOS sublayer, a XGXS PCS CMOS sublayer, and a XAUI transmit/receive CMOS sublayer. The single chip supports both 10 Gigabit Ethernet operation and 10 Gigabit Fibre Channel operation. The single chip interfaces to a MAC, an optical PMD, and non-volatile memory.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

This application also makes reference to, claims priority to and claimsthe benefit of U.S. Provisional Patent Application Ser. No. 60/402,097filed on Aug. 7, 2002 and entitled “System and Method for Implementing aSingle Chip having a Miltiple Sub-Layer PHY.”

“U.S. Pat. No. 6,424,194, U.S. application Ser. No. 09/540,243 filed onMar. 31, 2000, U.S. Pat. Nos. 6,389,092, 6,340,899, U.S. applicationSer. No. 09/919,636 filed on Jul. 31, 2001, U.S. application Ser. No.09/860,284 filed on May 18, 2001, U.S. application Ser. No. 10/028,806filed on Oct. 25, 2001, U.S. application Ser. No. 09/969,837 filed onOct. 1, 2001, U.S. application Ser. No. 10/159,788 entitled “PhaseAdjustment in High Speed CDR Using Current DAC” filed on May 30, 2002,and U.S. application Ser. No. 10/179,735 entitled “UniversalSingle-Ended Parallel Bus; fka, Using 1.8V Power Supply in .13 MM CMOS”filed on Jun. 21, 2002, are each incorporated herein by reference intheir entirety.

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BACKGROUND OF THE INVENTION

Embodiments of the present invention relate generally to a system andmethod corresponding to part of a physical layer (PHY) in a high-speeddigital communications system, and more particularly to integrating manyof the physical layer functions in a high-speed digital transceivermodule.

High-speed digital communication networks over copper and optical fiberare used in many network communication and digital storage applications.Ethernet and Fibre Channel are two widely used communication protocolsused today and continue to evolve to respond to the increasing need forhigher bandwidth in digital communication systems.

The Open Systems Interconnection (OSI) model (ISO standard) wasdeveloped to establish standardization for linking heterogeneouscomputer and communication systems. The OSI model includes sevendistinct functional layers including Layer 7: an application layer;Layer 6: a presentation layer; Layer 5: a session layer; Layer 4: atransport layer; Layer 3: a network layer; Layer 2: a data link layer;and Layer 1: a physical layer. Each OSI layer is responsible forestablishing what is to be done at that layer of the network but not howto implement it.

Layers 1 to 4 handle network control and data transmission andreception. Layers 5 to 7 handle application issues. Specific functionsof each layer may vary to a certain extent, depending on the exactrequirements of a given protocol to be implemented for the layer. Forexample, the Ethernet protocol provides collision detection and carriersensing in the data link layer.

The physical layer, Layer 1, is responsible for handling all electrical,optical, and mechanical requirements for interfacing to thecommunication media. The physical layer provides encoding and decoding,synchronization, clock data recovery, and transmission and reception ofbit streams. Typically, high-speed electrical or optical transceiversare the hardware elements used to implement this layer.

As data rate and bandwidth requirements increase, 10 Gigabit datatransmission rates are being developed and implemented in high-speednetworks. There is much pressure to develop a 10 Gigabit physical layerfor high-speed serial data applications. XENPAK (XAUI modulespecification) compatible transceivers for 10 G applications may be usedfor the 10 G physical layer. XPAK (second generation to XENPAKspecification) compatible transceivers for 10 G applications may also beused for the 10 G physical layer. The specification IEEE P802.3ae draft5 describes the physical layer requirements for 10 Gigabit Ethernetapplications and is incorporated herein by reference in its entirety.The 10 Gigabit Fibre Channel standard draft describes the physical layerrequirements for 10 Gigabit Fibre Channel applications.

An optical-based transceiver, for example, includes various functionalcomponents such as clock data recovery, clock multiplication,serialization/de-serialization, encoding/decoding, electrical/opticalconversion, descrambling, media access control, controlling, and datastorage. Many of the functional components are often implemented inseparate IC chips.

In the physical layer, several sublayers are supported. As an example,for 10 Gigabit serial operation, some of the key sublayers include a PMDTX/RX (physical media dependent transmit and receive) sublayer, a PMDPCS (physical media dependent physical encoding) sublayer, a XGXS PCS(10 Gigabit media independent interface extender physical encoding)sublayer, and a XAUI TX/RX (10 Gigabit attachment unit interfacetransmit and receive) sublayer.

FIGS. 1-3 show typical implementations of the various sublayers. In FIG.1, the XAUI TX/RX sublayer and the XGXS PCS sublayer are implemented inCMOS on a single chip. The PMD PCS sublayer and PMD TX/RX sublayer areimplemented on a second chip where the PMD PCS sublayer is implementedin 0.18 micron CMOS technology and the PMD TX/RX sublayer is implementedin SiGe technology. An interface between the two chips is required suchas a XGMII (10 Gb media independent interface). The differenttechnologies of the different chips and within the second chip requiredifferent voltage levels and, therefore, additional level translationcircuitry within the transceiver module and/or within the second chip.Also, the interface between the two chips adds additional complexity andextra power dissipation to the transceiver module.

In FIG. 2, the XAUI TX/RX sublayer and the XGXS PCS and PMD PCSsublayers are implemented on a single chip in CMOS technology. The PMDTX/RX sublayer is implemented on a second chip in SiGe technology. Aninterface between the two chips is required. The different technologiesof the different chips require different voltage levels and, therefore,additional level translation circuitry within the transceiver module.Also, the interface between the two chips adds additional complexity andextra power dissipation to the transceiver module.

In FIG. 3, the XAUI TX/RX sublayer, and the XGXS PCS and PMD PCSsublayers are implemented on a single chip in 0.18 micron CMOStechnology. Also, the PMD TX/RX sublayer is implemented on the same chipwith SiGe technology. All four sublayers are implemented on a singlechip but using a combination of different technologies. The differenttechnologies require different voltage levels and, therefore, additionalcircuitry to perform level translation of voltages within the chip.Also, the mixture of different process technologies will add extra stepsto the fabrication process which will increase cost.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with the present invention as set forth inthe remainder of the present application with reference to the drawings.

BRIEF SUMMARY OF THE INVENTION

Certain embodiments of the present invention provide a method and systemfor supporting 10 Gigabit digital serial communications. Aspects of thepresent invention address one or more of the problems outlined above. Itis desirable to combine many of the functional components and sublayersof a 10 Gigabit transceiver module into a single IC chip using the sametechnology throughout to reduce cost, power consumption, complexity, andnoise and to enhance overall transceiver performance.

A system of the present invention includes a single-chip multi-sublayerPHY comprising a PMD transmit/receive CMOS sublayer, a PMD PCS CMOSsublayer, a XGXS PCS CMOS sublayer, and a XAUI transmit/receive CMOSsublayer using a single CMOS technology. The single-chip multi-sublayerPHY supports both 10 Gigabit Ethernet operation and 10 Gigabit FibreChannel operation.

A method of the present invention provides for integrating a PMDtransmit/receive CMOS sublayer, a PMD PCS CMOS sublayer, a XGXS PCS CMOSsublayer, and a XAUI transmit/receive CMOS sublayer into a single-chipmulti-sublayer PHY using a single CMOS technology. Both 10 GigabitEthernet operation and 10 Gigabit Fibre Channel operation are supportedby said integrating.

These and other advantages, aspects and novel features of the presentinvention, as well as details of an illustrated embodiment thereof, willbe more fully understood from the following description and drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a schematic block diagram of a first typical implementation ofseveral physical layer sublayers in a transceiver module.

FIG. 2 is a schematic block diagram of a second typical implementationof several physical layer sublayers in a transceiver module.

FIG. 3 is a schematic block diagram of a third typical implementation ofseveral physical layer sublayers in a transceiver module.

FIG. 4 is a schematic block diagram illustrating certain components of a10 Gigabit transceiver module with a XAUI interface in accordance withan embodiment of the present invention.

FIG. 5 is a schematic block diagram of a single-chip multi-sublayer PHYused in the transceiver module of FIG. 4 in accordance with anembodiment of the present invention.

FIG. 6 is a schematic block diagram of the single-chip multi-sublayerPHY of FIG. 5 illustrating the various sublayers in accordance with anembodiment of the present invention.

FIG. 7 is a more detailed schematic block diagram of the single-chipmulti-sublayer PHY of FIG. 5 used in the transceiver module of FIG. 4 inaccordance with an embodiment of the present invention.

FIG. 8 is a schematic block diagram of the single-chip multi-sublayerPHY of FIG. 5 illustrating a synchronous mode and an asynchronous modein accordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The PMD TX/RX sublayer (physical media dependent transmit and receivesublayer) provides the electrical functionality for transmission andreception of 10 Gigabit serial data. The functionality includes clockmultiplication and data serialization, clock data recovery and datade-serialization, signal amplification and equalization, anddifferential signal driving.

The PMD PCS sublayer (physical media dependent physical encodingsublayer) is responsible for coding data to be transmitted and decodingdata to be received on the PMD side of the transceiver. Thefunctionality includes 64B/66B synchronization, descrambling, anddecoding, 64B/66B encoding and scrambling, data transitioning,multiplexing, and phase detecting.

The XGXS PCS sublayer (10 Gigabit media independent interface extenderphysical encoding sublayer) is responsible for coding data to betransmitted and decoding data to be received on the XAUI side of thetransceiver. The functionality includes 8B/10B encoding, 8B/10Bdecoding, randomizing, and lane alignment.

The XAUI TX/RX sublayer (10 Gigabit attachment unit interface transmitand receive sublayer) provides the electrical functionality fortransmission and reception of 3 Gigabit 4-channel serial data. Thefunctionality includes clock multiplication and data serialization,clock data recovery and data de-serialization, signal amplification, anddifferential signal driving.

FIG. 4 is a schematic block diagram illustrating certain components of aGigabit transceiver module 5 with a XAUI interface 15 in accordance withan embodiment of the present invention. The transceiver module 5 may, inone embodiment of the present invention, be compatible with the XENPAKoptical module standard. The transceiver module 5 may, in one embodimentof the present invention, be compatible with the XPAK optical modulestandard. The transceiver module 5 includes, for example, a single-chipmulti-sublayer PHY 10, an optical PMD 30, and an EEPROM 40.

According to an embodiment of the present invention, a media accesscontroller (MAC) 20 interfaces to the single-chip multi-sublayer PHY 10through the XAUI transmit and receive interface 15. In general, the MAClayer is one of two sublayers of the data link control layer and isconcerned with sharing the physical connection to a network amongseveral upper-level systems. The single-chip multi-sublayer PHY 10interfaces to the optical PMD 30 through a PMD transmit and receiveinterface 17. The MAC 20 also interfaces to the single-chipmulti-sublayer PHY 10 through the serial MDIO (management datainput/output) interface 16. The single-chip multi-sublayer PHY 10 alsointerfaces to EEPROM 40 through a two-wire serial interface 19. Aseparate XGMII (10 Gigabit media independent interface) is not needed.

The XAUI interface 15 includes 4 channels of 3 Gigabit serial datareceived by the single-chip multi-sublayer PHY 10 from the MAC 20 and 4channels of 3 Gigabit serial data transmitted from the single-chipmulti-sublayer PHY 10 to the MAC 20. In an embodiment of the presentinvention, the MAC includes a XGXS sublayer interface and areconciliation sublayer (RS) interface. In one embodiment of the presentinvention, for Ethernet operation, the 3 Gigabit data rate is actually3.125 Gbps and for Fibre Channel operation, the 3 Gigabit data rate isactually 3.1875 Gbps.

The PMD interface 17 includes a 10 Gigabit serial transmit differentialinterface and a 10 Gigabit serial receive differential interface betweenthe single-chip multi-sublayer PHY 10 and the optical PMD 30 inaccordance with an embodiment of the present invention. In oneembodiment of the present invention, for Ethernet operation, the 10Gigabit data rate is actually 10.3125 Gbps and for Fibre Channeloperation, the 10 Gigabit data rate is actually 10.5188 Gbps.

FIG. 5 is a schematic block diagram of the single-chip multi-sublayerPHY 10 used in the transceiver module 5 of FIG. 4 in accordance with anembodiment of the present invention. The single-chip multi-sublayer PHY10 includes a PMD transmit (TX) section 110, a PMD receive (RX) section120, a digital core section 130, a XAUI transmit (TX) section 140, and aXAUI receive (RX) section 150.

Referring to FIG. 6, the PMD TX section 110 and PMD RX section 120 forma 10 Gigabit PMD TX/RX sublayer 220 in accordance with an embodiment ofthe present invention. The XAUI TX section 140 and XAUI RX section 150form a 3 Gigabit XAUI TX/RX sublayer 210 in accordance with anembodiment of the present invention. The digital core section 130comprises a XGXS PCS sublayer 230 and PMD PCS sublayer 240 in accordancewith an embodiment of the present invention.

FIG. 7 is a more detailed schematic block diagram of the single-chipmulti-sublayer PHY 10 of FIG. 5 used in the transceiver module 5 of FIG.4 in accordance with an embodiment of the present invention. Thesingle-chip multi-sublayer PHY 10 comprises three main blocks includinga transmit block 310, a receive block 340, and a management and controlblock 370 including management registers and control interface 372 andoptics control and status 374. Clock interfaces are provided forconfiguring the XAUI and PMD interfaces to asynchronous or independentasynchronous operations in accordance with an embodiment of the presentinvention.

The transmit block 310 collects 4-lane 3 Gigabit data at the XAUIreceivers 150 and reformats the data for 10 Gigabit serial transmissionat the PMD differential CML drivers 110 in accordance with an embodimentof the present invention. The PMD CMU (clock multiplier unit)/Serializer316 in the PMD TX/RX sublayer 220 is phase-locked to an externalreference clock 332. Each XAUI receiver (one per lane) in the XAUI TX/RXsublayer 210 has an internal delayed-lock loop (DLL), in DLL &Deserializer 318, to synchronize the sampling clock to the incomingdata. After synchronization, a 3 Gigabit sampling clock samples the datain the center of the data eye pattern. The phase relationship betweenthe edge transitions of the data and those of the sampling clock arecompared by a phase/frequency discriminator. Output pulses from thediscriminator indicate the direction of phase corrections. The pulsesare smoothed by a loop filter. The output of the loop filter controlsthe internal phase interpolators which generate the sampling clock. TheXAUI CMU phase locked loop (PLL) within the XAUI TX/RX sublayer 210generates the clocks for the internal DLL phase interpolations.

For each XAUI DLL of the DLL & Deserializer 318 within the XAUI TX/RXsublayer 210, the single-chip multi-sublayer PHY 10 contains aloss-of-signal (LOS) detect circuit which monitors for data present atthe XAUI receiver inputs 312. A minimum single-ended input signal swingis used for a valid lock condition. The status of each individual LOSdetector is observable in an internal register of the single-chip 10.

The XAUI serial inputs 312 to the XAUI TX/RX sublayer 210 are to beAC-coupled in accordance with an embodiment of the present invention. ACcoupling prevents voltage drops across input devices of the single-chip10 when the input signals are sourced from a higher operating voltagedevice. If DC coupling is used, care is exercised to guarantee that theinput signals do not exceed VDD levels. Noise due to overshoot andundershoot transients are also to be accounted for.

Each XAUI serial data stream is de-serialized to a 10-bit word by aserial-to-parallel converter of the DLL & Deserializer 318 within theXAUI TX/RX sublayer 210. The DLL output clocks the serial-to-parallelconverter. Under normal operation, the DLL recovers the clock from thedata. If data is not present, the clock is recovered from the internalreference clock. The output is sent to the XGXS PCS sublayer 230 in thedigital core 130.

A sync acquisition sub-block (part of Sync Detect; Lane Sync; 8B/10BDecoder 320) in the XGXS PCS sublayer 230 within the digital core 130performs code group synchronization on the incoming 10-bit bytes fromthe DLL & Deserializer 318. A two-stage 10-bit shift register is used torecognize the valid boundary of the /COMMA/ (K28.5) code group. Once asingle /COMMA/ is detected, the 8B/10B decoder (in Sync Detect; LaneSync; 8B/10B Decoder 320) is enabled. Upon detection of four /COMMA/code groups without any intervening invalid code group errors, SyncAcquisition is declared.

The 8B/10B decoder (in Sync Detect; Lane Sync; 8B/10B Decoder 320)performs illegal code checks, running disparity checks, invalid codechecks, and miscellaneous decoding logic within the XGXS PCS sublayer230. Both an illegal code and a running disparity error may cause aninvalid code which advances the invalid code counter for performancemonitoring. The invalid code counter is cleared upon a read access.

Running disparity (RD) is the difference between the number of 1's and0's in a block of data. RD is positive when there are more ones andnegative when there are more zeros. Each encoded 10 bits must have a RDof 0, +2, or −2 to ensure a high bit transition density for reliableclock recovery. Additionally, the RD encoding is alternated for DCbalancing (maintaining an equal number of 1's and 0's). When an invalidcode is received, the decoder replaces it with an /E/ (error code) K30.7and increments the invalid counter. If a legitimate /E/ is received, thedecoder passes it to the PCS without incrementing the invalid counter.

At the beginning of lane alignment each of the four Lane Alignment FIFOwrite-pointers (of the Lane Alignment FIFOs 322 within the XGXS PCSsublayer 230) is enabled upon detection of an /A/ on its lane inaccordance with an embodiment of the present invention. The FIFO's 322common read-pointer is enabled when all four XAUI lanes have detected/A/. Once an /A/ is detected in one lane without /A/ detections in theother three lanes within a programmable window (skew budget), all FIFOs322 are reset forcing the lane alignment to start over again. The LaneAlignment FIFOs 322 support lane skew compensation of up to 5byte-clocks. The device allows the user to have the external 21 UI asspecified in IEEE 802.3ae.

The PMD PCS sublayer 240 uses a transmission code to improve thetransmission characteristics of information to be transferred across thelink and to support transmission of control and data characters inaccordance with an embodiment of the present invention. The 64B/66Bencoding (defined by IEEE 802.2ae clause 49 for transmission code andperformed by the 64B/66B Encoder/Scrambler 326) ensures that sufficienttransitions are present in the PHY bit stream to make clock recoverypossible at the receiver.

The TX gearbox 328 in the PMD PCS sublayer 240 is a buffer that converts66-bit data to 64-bit data for more efficient serialization. The TXgearbox 328 receives 66-bit data from the 64B/66B Encoder/Scrambler 326and a 2-bit sync from the Type Generator at 156.25 MHz. The TX gearbox328 outputs 64-bit data at 322.265 MHz to the PMD CMU/Serializer 316within the PMD TX/RX sublayer 220. A register bank is employed which isaccessed in a circular manner.

Data is read out of the TX gearbox 328 using an internally generated322.265 MHz clock. The data is converted to a 10 Gigabit serial streamwithin PMD TX/RX sublayer 220 and driven off-chip. Bit 0 of frame 0(LSB) is shifted out first.

The PMD CMU/Serializer 316 within the PMD TX/RX sublayer 220 has a PLLthat generates the 10 Gigabit clock by multiplying the internal 156.25MHz reference clock.

The single chip 10 includes a lock detect circuit, which monitors thefrequency of the internal VCO. The lock detect status is observable inthe Analog Transceiver Status Register 0. Register bit P_LKDTCMU goeshigh when the PMD CMU PLL is locked. The CMU lock detect signal is alsoprovided as an output status at the PCMULK pin 330.

The CML serial outputs (PCOP/N and PDOP/N) 314 may be AC-coupled orDC-coupled. The CML outputs are powered at +1.8V. Certain pins providepower to PCOP/N and PDOP/N, respectively. These high-speed CML outputscomprise a differential pair designed to drive a 50Ω transmission line.The output driver is back terminated to 50Ω on-chip, providing snubbingof any reflections.

An optical enable output, controlled by the TXON discrete input or theManagement Interface allows for the option to deactivate the opticaltransmitter in the optical PMD 30. The polarity of PDIP/N 344 and PDOP/N342 may be reversed to accommodate difficult printed circuit board (PCB)layouts. Each differential signal pair has its own polarity control bitin the PMD/Optics Digital Control Register.

The single-chip 10 complies with the jitter specifications proposed for10-Gbps Ethernet equipment defined by IEEE 802.3ae. The reference clockcharacteristics adhere to the requirements in accordance with anembodiment of the present invention.

The receiver block 340 accepts 10 Gigabit serial PMD data and reformatsthe data for transmission on the 4-lane 3 Gigabit XAUI transmitters 362.One of the 3 Gigabit CMU clocks in the XAUI TX/RX sublayer 210 is usedto retime all four XAUI transmitters. The XAUI CMU 346 in the XAUI TX/RXsublayer 210 is phase-locked to an external reference clock.

The PMD clock and data recovery (CDR)/Deserializer 348 within the PMDTX/RX sublayer 220 generates a clock that is at the same frequency asthe incoming data bit rate (10 Gigabit data rate) at the serial datainputs, PDIP/N 344. The clock is phase-aligned by a PLL so that itsamples the data in the center of the data eye pattern in accordancewith an embodiment of the present invention.

The phase relationship between the edge transitions of the data andthose of the generated clock are compared by a phase/frequencydiscriminator. Output pulses from the discriminator indicate thedirection of phase corrections.

The output of the loop filter controls the frequency of the VCO, whichgenerates the recovered clock. Frequency stability without incoming datais guaranteed by an internal reference clock that the PLL locks ontowhen data is lost.

The single-chip 10 includes a lock detect circuit that monitors the 10Gigabit frequency of the internal VCO within the PMD TX/RX sublayer 220.The frequency of the incoming data stream is within ±100 ppm of the 10Gigabit data stream for the lock detector to declare signal lock. Thelock detect status is observable in the Analog Transceiver StatusRegister 0. P_LKDTCDR goes high when the PMD CDR/Deserializer 348 islocked to the incoming data. The CDR lock detect signal is also providedas an output status at the PCDRLK pin 348A.

The single-chip 10 includes a loss-of-signal (LOS) detect circuit thatmonitors the integrity of the serial receiver data path in the PMD TX/RXsublayer 220. A peak detector looks for a minimum amplitude swing. Ifthe serial data input is not present, the LOS_P bit in the AnalogTransceiver Status Register 0 is set to zero.

The CDR/Deserializer 348 attempts to lock to the reference clock whenthe signal is less than the minimum amplitude swing and the P-LOSB_SELbit is set accordingly. The loss of signal (LOS) from a peak detectorcondition is also reflected at the PLOSB output signal pin 351.

The OPRXLOS 376 input pin is used by the external optical receiver's LOSmonitoring to indicate the loss-of-light condition. The OPRXLOS directlyor combined with the peak detector logic described above could force theCDR/Deserializer 348 to lock to the reference clock. The OPRXLOSpolarity is programmable with the OPINLVL control bit in the PHYIdentifier Register or pin OPINLVL 378 in accordance with an embodimentof the present invention.

The PMD CML serial inputs (PDIP/N) 344 on the single-chip 10 may beAC-coupled. AC coupling prevents voltage drops across input devices ofthe single-chip 10 when the input signals are sourced from a higheroperating voltage device. If DC coupling is used, care should beexercised to guarantee that the input signals do not exceed VDD levels.Noise due to overshoot and undershoot transients should be accountedfor.

The PMD serial data stream is deserialized by a serial-to-parallelconverter of CDR/Deserializer 348 in the PMD TX/RX sublayer 220. The CDRoutput clocks the serial-to-parallel converter. Under normal operation,the CDR recovers the clock from the data. If data is not present, theclock is recovered from the internal reference clock. The output is sentto the RX Gearbox 350 within PMD PCS sublayer 240. The RX Gearbox 350performs an equivalent function (in reverse) as the TX Gearbox 328.

A Frame Synchronizer (which is a part of the 64B/66BSynchronizer/Descrambler/Decoder 352 in the PMD PCS sublayer 240)searches for the 66-bit boundary of the frame data and obtains lock to66-bit blocks using the sync header and outputs 66-bit blocks. Thedescrambler (which is also a part of the 64B/66BSynchronizer/Descrambler/Decoder 352 in the PMD PCS sublayer 240)processes the payload to reverse the effect of the scrambler using thesame polynomial. The receiver process decodes blocks according to IEEE802.3ae clause 49.

The Randomizer 356 in XGXS PCS sublayer 230 reduces EMI during theinterpacket gap (IPG). The resultant idle patterns at the XAUItransmitters would be a repetitive high-frequency signal due to the8B/10B encoder 358. The Randomizer 356 outputs random /A/K/R/ patternsin all for lanes during the IPG. The Randomizer 356 starts on the columncontaining the End-of-Packet byte, EOP (T), and ends on SOP(start-of-packet). The polynomial, 1+x³+x⁷ is used by the Randomizer356. For example, refer to IEEE 802.3ae Draft 5.0.

The 8B/10B Encoder 358 within the XGXS PCS sublayer 230 converts abyte-wide data stream of random 1's and 0's into a 10-bit DC-balancedserial stream of 1's and 0's with a maximum run length of 6. The codeprovides sufficient bit transitions to ensure reliable clock recovery.

Data is read out of the 8B/10B Encoder 358 using an internally generated312.0-MHz clock. The data is then converted to a 3 Gigabit serial streamby Serializer 360 within XAUI TX/RX sublayer 210 and driven off-chip.Bit 0 of frame 0 (LSB) is shifted out first and is mapped to “A” of the8B/10B encoder in accordance with an embodiment of the presentinvention.

The XAUI CMU 346 within the XAUI TX/RX sublayer 210 has a PLL thatgenerates the 3 Gigabit clock by multiplying the internal 156.25-MHzreference clock in accordance with an embodiment of the presentinvention. The single-chip 10 includes a lock detect circuit, whichmonitors the frequency of the internal VCO. The CMU lock detect bit goeshigh when the XAUI CMU PLL is locked. The lock detect status is in theAnalog Transceiver Status Register 0, bit 7.

The XAUI serial outputs, X[A:D]OP/N 362, may be AC-coupled. The CMLoutputs are powered at +1.2V. The high-speed XAUI outputs comprise adifferential pair designated to drive a 50′Ω transmission line. Theoutput driver is back terminated to 50′Ω on-chip, providing snubbing ofany reflections. The output driver also has pre-emphasis capability tocompensate for frequency selective attenuation of FR-4 traces tocompensate for ISI (inter symbol interference). The option is controlledvia the XAUI Pre-emphasis Controller Register in accordance with anembodiment of the present invention.

The single-chip XAUI transmit and receive block interfaces provide theoption to reverse the lane order and/or the lane polarity. The option iscontrolled via the XAUI Digital Control Register. The XAUI I/O interfacelane assignment package pins may be reversed to accommodate difficultPCB layouts. A lane flipper optionally performs a byte-wise flip of theinternal 32-bit data. By default, lane A carries byte 0, lane B carriesbyte 1, lane C carries byte 2, and lane D carries byte 3. When the LaneFlipper is enabled, lane A carries byte 3, lane B carries byte 2, lane Ccarries byte 1, and lane D carries byte 0. Setting bits XAUI_TX_FLIP_Band XAUI_RX_FLIP_B in the Management Interface XAUI Digital ControlRegister to zero reverses the XAUI lane order in accordance with anembodiment of the present invention.

The XAUI I/O interface bit assignment (P to N) to package pins may bereversed to accommodate difficult PCB layouts. Assert bits XAUI_TZ_INVand XAUI_RX_INV in the Management Interface XAUI Digital ControlRegister to reverse the XAUI lane polarity.

The single-chip multi-sublayer PHY 10 supports asynchronous clockingmode operation of the XAUI and PMD interfaces. The local reference clockor external transmit VCXO may adhere to the IEEE specifications.

In the asynchronous mode, an elastic FIFO 354 is used that accommodatesa frequency difference of up to 200 ppm between a recovered clock and alocal reference clock. Both the RX and TX data paths 310 and 320 containelastic FIFOs 354 and 324. Idle columns of four bytes are inserted ordeleted during the IPG (inter packet gap) once the distance between theelastic FIFO's read and write pointers exceed a threshold. In addition,a column of sequence orders may be deleted during the IPG once thedistance between the elastic FIFO's read and write pointer exceed athreshold. The delete adjustments only occur on IPG streams that containat least two columns of idles or sequence order sets.

Referring to FIG. 8, the single-chip 10 supports an asynchronous modethat uses an external reference clock 301 (or two external referenceclocks 301 and 302) for the PMD transmitter 110 and XAUI transmitter 140in accordance with an embodiment of the present invention. Therefore,the Elastic FIFOs 324 and 354 are enabled to accommodate frequencydifferences between the XAUI DLL clock and the PMD CMU clock (externalreference clock) and the PMD CDR clock and the XAUI CMU clock (externalreference clock). The asynchronous mode also supports an independenttransmit path reference clock and a receive path reference clock.

Clock cleanup mode uses the external VCXO to clean up a noisy systemclock provided for the asynchronous mode of operation. The transmitblock phase detector locks to the external reference clock rather thanthe XAUI DLL clock. The cleanup PLL lock detect status is available inAnalog Transceiver Status Register, bit 1.

In the synchronous mode, a 156 MHz reference clock is derived within thesingle-chip 10 from the incoming 10 Gigabit data on the PMD side. Also,a 156 MHz reference clock is derived from the incoming 3 Gigabit data onthe XAUI side. Clean-up PLL's 303 and 304 may be used (see FIG. 8) toclean up any noise on the internally generated reference clocks. FIG. 8illustrates that the single-chip 10 may be switched between theasynchronous mode and the synchronous mode in accordance with anembodiment of the present invention.

In one embodiment of the present invention, all modes of the single-chipmulti-sublayer PHY 10 are programmable, including synchronous mode,asynchronous mode, Ethernet mode, and Fibre Channel mode. The EEPROM 40may be pre-programmed to power up the transceiver module 5 into certainmodes.

In an embodiment of the present invention, the same single-chip 10 maybe used for 10 Gigabit Ethernet applications and for 10 Gigabit FibreChannel applications. In other words, a user may purchase a single chipand select a 10 Gigabit Ethernet configuration, a 10 Gigabit FibreChannel configuration, or both.

The single-chip 10 supports the IEEE 802.3 Clause 45 Station ManagementInterface. A 1-bit shift register receives data from the MDIO pin 16 ofFIG. 4 (380 in FIG. 7) on the rising edge of the MDC clock pin 18 ofFIG. 4 (380A in FIG. 7). The frame format begins with a preamble forclock synchronization followed by the start-of-frame sequence. The reador write op-code, PRTAD and DVEAD fields follow next. Three device typesare supported by DVEAD:00001=PMA/PMD, 00011=PCS, or 00100=XGXS PHY.Depending on the read/write op-code, data is either received ortransmitted by the single-chip 10. Once the 16-bit data field istransferred, the MDIO signal 16 is returned to a high-impedance state(idle).

During idle, MDC 18 is not required to be active. A read operationconfigures the MDIO 16 as an output. A write operation configures theMDIO 16 as an input. Writes to an unsupported register address areignored. The PRTAD field is configurable via the PRTAD pins. The MDIOinterface 16 supports 1.2V operation in accordance with an embodiment ofthe present invention.

The single-chip 10 provides a 2-wire serial interface 19 (381-383 inFIG. 7) that enables the system to access external nonvolatile memorydevices through the MDIO interface 16. The single-chip 10 2-wire serialinterface 19 accesses the external devices through two dedicatedinterface signals, SDA (data) 383 and SCL (clock) 382.

The nonvolatile memory 40 stores device configuration and optical-moduledata, such as module identification, transceiver capabilities, standardlevel of support, manufacture, and vendor information. The content isprogrammed into the EEPROM 40 by the module vendor at manufacture. Thedefault data rate setting for 2-wire is 100 kHz. The 2-wire interface 19supports up to 32 kilobytes of memory-accessing with burst read or writemode operations. The 2-wire interface 19 supports reads from thestarting location of the last location written to incremented by 1.

A random read sets the address point to the desired location. The EEPROMaddress pointer may be set for the location to be read. The single-chip10 does not support multi-Master Arbitration. The 2WENB signal 381permits tristating the SDA 383 and SCL 382 outputs to allow other masterdevices access to the EEPROM 40. A clock synchronizing mechanism isprovided at the 2-wire interface 19 as a handshake means for thebyte-level data transfers between the single-chip 10 and the EEPROMslave device 40.

The slave is able to hold the SCL line low after reception andacknowledgment of a byte and forces the master (single-chip 10) into await state until the slave is ready for the next byte transfer. Toaccommodate the feature, the high period of the clock immediatelyfollowing the acknowledge byte appears extended, even if the slave isimmediately ready for the transfer of the next byte.

The single-chip 10 loads the first 256 bytes of EEPROM location(000-255) into a shadow memory on-chip at MDIO address locations atinitialization through the 2-wire interface 19 in accordance with anembodiment of the present invention. After reset, the system should wait50 ms before accessing the shadow memory for proper content read. Shadowmemory is write-protected from certain address locations. Thesingle-chip 10 is capable of loading its control register setting fromthe EEPROM after exiting from the reset state.

In accordance with an embodiment of the present invention, all sublayersof the single-chip multi-sublayer PHY 10 are implemented in 0.13 micronCMOS technology.

The various elements of the system and method may be combined orseparated according to various embodiments of the present invention.

In summary, certain embodiments of the present invention afford anapproach for integrating multiple sublayers of a PHY onto a single-chipin such that the single-chip supports both 10 Gigabit Ethernet and 10Gigabit Fibre Channel operation in the same transceiver module.

While the invention has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the invention. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the invention without departing from its scope.Therefore, it is intended that the invention not be limited to theparticular embodiment disclosed, but that the invention will include allembodiments falling within the scope of the appended claims.

1. A single-chip multi-sublayer PHY to support 10 Gigabit digital serialcommunications, said single-chip comprising: a Physical Media Dependent(PMD) transmit/receive Complementary Metal Oxide Semiconductor (CMOS)sublayer supporting at least 10 Gigabit Ethernet operation, 10 GigabitFibre Channel operation, and signal equalization, wherein said PMDtransmit/receive CMOS sublayer comprises a PMD transmitter and a PMDreceiver; a Physical Media Dependent Physical Coding Sublayer (PMD PCS)CMOS sublayer supporting at least 10 Gigabit Ethernet operation and 10Gigabit Fibre Channel operation; a 10 Gigabit Ethernet Physical CodingSublayer (XGXS PCS) CMOS sublayer supporting at least 10 GigabitEthernet operation and 10 Gigabit Fibre Channel operation; and a 10Gigabit Attachment Unit Interface (XAUI) transmit/receive CMOS sublayersupporting at least 10 Gigabit Ethernet operation and 10 Gigabit FibreChannel operation, wherein said XAUI transmit/receive CMOS sublayercomprises a XAUI transmitter and a XAUI receiver, wherein said PMDtransmitter and said XAUI transmitter are operable to switch between atleast one internally generated reference clock and at least oneexternally generated reference clock to support the 10 Gigabit digitalserial communications based upon an asynchronous mode or synchronousmode, wherein said single-chip operates in said synchronous mode usingsaid at least one internally generated reference clock and saidsingle-chip operates in said asynchronous mode using said at least oneexternally generated reference clock.
 2. The single-chip of claim 1,wherein said PMD transmit/receive CMOS sublayer, said PMD PCS CMOSsublayer, said XGXS PCS CMOS sublayer, and said XAUI transmit/receiveCMOS sublayer comprise 0.13 micron CMOS technology.
 3. The single-chipof claim 1, wherein said XAUI transmit/receive CMOS sublayer comprisesan interface to a media access controller (MAC).
 4. The single-chip ofclaim 1, wherein said PMD transmit/receive CMOS sublayer comprises aninterface to an optical PMD.
 5. The single-chip of claim 1, wherein saidsingle chip comprises an interface to a non-volatile memory.
 6. Thesingle-chip of claim 1, wherein said single chip comprises a single MDIOinterface.
 7. The single-chip of claim 1, wherein said single-chip iscompatible with a XENPAK Multi-Source Agreement.
 8. The single-chip ofclaim 1, wherein said single-chip is compatible with a XPAK Multi-SourceAgreement.
 9. A method to support 8 Gigabit digital serialcommunications, said method comprising: integrating a Physical MediaDependent (PMD) transmit/receive Complementary Metal Oxide Semiconductor(CMOS) sublayer into a single-chip multi-sublayer PHY to support atleast 10 Gigabit Ethernet operation, 10 Gigabit Fibre Channel operation,and signal equalization, wherein said PMD transmit/receive CMOS sublayercomprises a PMD transmitter and a PMD receiver; integrating a PhysicalMedia Dependent Physical Coding Sublayer (PMD PCS) CMOS sublayer intosaid single-chip multi-sublayer PHY to support at least 10 GigabitEthernet operation and 10 Gigabit Fibre Channel operation; integrating a10 Gigabit Ethernet Physical Coding Sublayer (XGXS PCS) CMOS sublayerinto said single-chip multi-sublayer PHY to support at least 10 GigabitEthernet operation and 10 Gigabit Fibre Channel operation; andintegrating a 10 Gigabit Attachment Unit Interface (XAUI)transmit/receive CMOS sublayer into said single-chip multi-sublayer PHYto support at least 10 Gigabit Ethernet operation and 10 Gigabit FibreChannel operation, wherein said XAUI transmit/receive CMOS sublayercomprises a XAUI transmitter and a XAUI receiver, wherein said PMDtransmitter and said XAUI transmitter are operable to switch between atleast one internally generated reference clock and at least oneexternally generated reference clock to support said 10 Gigabit digitalserial communications based upon an asynchronous mode or synchronousmode, wherein said single-chip multi-sublayer PHY operates in saidsynchronous mode using said at least one internally generated referenceclock and said single-chip multi-sublayer PHY operates in saidasynchronous mode using said at least one externally generated referenceclock.
 10. The method of claim 9, wherein said PMD transmit/receive CMOSsublayer, said PMD PCS CMOS sublayer, said XGXS PCS CMOS sublayer, andsaid XAUI transmit/receive CMOS sublayer comprise 0.13 micron CMOStechnology.
 11. The method of claim 9, comprising interfacing said XAUItransmit/receive CMOS sublayer to a media access controller (MAC). 12.The method of claim 9, comprising interfacing said PMD transmit/receiveCMOS sublayer to an optical PMD.
 13. The method of claim 9, comprisinginterfacing said single-chip to a non-volatile memory.
 14. The method ofclaim 9, comprising integrating a single MDIO interface into saidsingle-chip.
 15. The method of claim 9, wherein said single-chip iscompatible with a XENPAK Multi-Source Agreement.
 16. The method of claim9, wherein said single-chip is compatible with a XPAK Multi-SourceAgreement.